San José, Oct 14 (EFE) .- The technology company Intel highlighted on Thursday the contribution of human talent from Latin America for the growth of the company in innovation and development of microprocessors, as well as for the promotion of strategies with a view to the future full of challenges.
Regional representatives of the company highlighted in a virtual meeting with journalists the importance of the facilities located in Mexico and Costa Rica for operations, where engineering and development work is carried out, as well as testing and assembly of microprocessors.
“We have shown that we are a competitive region, that in what we are capable of doing we are on an equal footing with the United States and Asia,” said Ronny Ramírez, global operations manager for Intel Costa Rica Graphics Development.
The technology company plans to increase Latin America’s participation in its supply chain. Currently, Intel’s facilities in Asia account for 80% of that chain, which is intended to diversify by 2030 to reach 50% in Asia and 50% in America and Europe.
The company explained that for this it is executing investments around the world that include 20,000 million dollars in two plants in Arizona, United States, and 600 million dollars in the facilities in Costa Rica.
The experts explained that with the COVID-19 pandemic, demand increased sharply, which has caused a global shortage of some components.
The design and manufacturing process is very complex and these are stages in which Intel’s facilities in Mexico and Costa Rica play a central role.
Engineers and scientists at the Intel Design Center in Guadalajara, Mexico, develop technologies that will be used in the semiconductor manufacturing process. For its part, Intel Costa Rica participates in several of these phases, such as the creation of masks that contain the information that will be used for each step of the manufacturing process.
Another stage in which Latin America plays a relevant role is in testing and assembly. Intel’s plant in Costa Rica is one of the few in the world that performs this process, where each chip is assembled in a package that protects it and allows it to connect to other components, so that its functionality is finally tested.
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